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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
TM
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Switching Diode
Part of the GreenLineTM Portfolio of devices with energy-conserving traits. This switching diode has the following features: * Very Low Leakage ( 500 pA) promotes extended battery life by decreasing energy waste. Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being in a non-forward-biased condition. * Offered in four Surface Mount package types * Available in 8 mm Tape and Reel in quantities of 3,000 Applications * ESD Protection * Reverse Polarity Protection * Steering Logic * Medium-Speed Switching
ANODE 3 CATHODE 1 2 CATHODE
MMBD1005LT1 MMBD2005T1 MMBD3005T1
Motorola Preferred Devices
MMBD1005LT1
3 1 2
CASE 318-07, STYLE 12 SOT-23 (TO-236AB)
MAXIMUM RATINGS
Rating Continuous Reverse Voltage Peak Forward Current Peak Forward Surge Current Symbol VR IF IFM (surge) Value 30 200 500 Unit Vdc mAdc mA
MMBD2005T1
3 1 2
DEVICE MARKING
MMBD1005LT1 = A3 MMBD2005T1 = DI MMBD3005T1 = XQ
CASE 419-02, STYLE 4 SC-70/SOT-323
MMBD3005T1
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR-4 Board (1) TA = 25C MMBD1005LT1, MMBD3005T1 MMBD2005T1 Derate above 25C MMBD1005LT1, MMBD3005T1 MMBD2005T1 Thermal Resistance Junction to Ambient MMBD1005LT1, MMBD3005T1 MMBD2005T1 Junction and Storage Temperature Symbol PD 225 150 1.8 1.2 RJA 556 833 - 55 to +150 C Max Unit mW
2 1 3
mW/C C/W
CASE 318D-03, STYLE 5 SC-59
TJ, Tstg
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. GreenLine is a trademark of Motorola, Inc. Thermal Clad is a registered trademark of the Berquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
Motorola Inc. 1995 (c) Motorola, Small-Signal Transistors, FETs and Diodes Device Data
1
MMBD1005LT1 MMBD2005T1 MMBD3005T1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Reverse Breakdown Voltage (IBR = 100 A) Reverse Voltage Leakage Current (VR = 75 V)(2) Forward Voltage (IF = 1.0 mA) Forward Voltage (IF = 10 mA) Diode Capacitance (VR = 0 V, f = 1.0 MHz) Reverse Recovery Time (IF = IR = 10 mA) (Figure 1) V(BR) IR VF CD trr 30 -- -- -- -- -- -- 500 850 950 2.0 3.0 V pA mV pF s Symbol Min Max Unit
(2) Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being in a non-forward-biased condition.
820 +10 V 2k 100 H 0.1 F DUT 50 OUTPUT PULSE GENERATOR 50 INPUT SAMPLING OSCILLOSCOPE 90% VR INPUT SIGNAL IR iR(REC) = 1 mA OUTPUT PULSE (IF = IR = 10 mA; measured at iR(REC) = 1 mA) IF 0.1 F tr 10% tp t IF trr t
Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp trr
Figure 1. Recovery Time Equivalent Test Circuit
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Motorola Small-Signal Transistors, FETs and Diodes Device Data
MMBD1005LT1 MMBD2005T1 MMBD3005T1
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.037 0.95 0.037 0.95
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95 0.037 0.95
0.098-0.118 2.5-3.0 0.094 2.4 0.039 1.0 0.031 0.8
inches mm
0.079 2.0 0.035 0.9 0.031 0.8
inches mm
SC-59
SOT-23
0.025 0.025 0.65 0.65
0.075 1.9 0.035 0.9 0.028 0.7 inches mm
2.36 0.093 4.19 0.165
SOD-123
SC-70/SOT-323 POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
The power dissipation for a surface mount device is a function of the drain/collector pad size. These can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows: PD = TJ(max) - TA RJA PD = 150C - 25C = 225 milliwatts 556C/W The 556C/W for the SOT-23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 250 milliwatts. There are other alternatives to achieving higher power dissipation from the surface mount packages. One is to increase the area of the drain/collector pad. By increasing the area of the drain/collector pad, the power dissipation can be increased. Although the power dissipation can almost be doubled with this method, area is taken up on the printed circuit board which can defeat the purpose of using surface mount technology. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. 3
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device. For example, for a SOT-23 device, PD is calculated as follows.
Motorola Small-Signal Transistors, FETs and Diodes Device Data
EEE EEE EEE EEE EEE EEE
0.91 0.036
EEEE EEEE EEEE EEEE EEEE EEEE
1.22 0.048
mm inches
MMBD1005LT1 MMBD2005T1 MMBD3005T1
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C.
* The soldering temperature and time should not exceed * When shifting from preheating to soldering, the maximum * After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. temperature gradient should be 5C or less. 260C for more than 10 seconds.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 8 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
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Motorola Small-Signal Transistors, FETs and Diodes Device Data
MMBD1005LT1 MMBD2005T1 MMBD3005T1
STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP" STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 "SPIKE" "SOAK" 170C 160C STEP 6 STEP 7 VENT COOLING 205 TO 219C PEAK AT SOLDER JOINT
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C
150C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
100C 100C
140C
DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 2. Typical Solder Heating Profile
Motorola Small-Signal Transistors, FETs and Diodes Device Data
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MMBD1005LT1 MMBD2005T1 MMBD3005T1
PACKAGE DIMENSIONS
A L
3
BS
1 2
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A B C D G H J K L S V INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0180 0.0236 0.0350 0.0401 0.0830 0.0984 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.45 0.60 0.89 1.02 2.10 2.50 0.45 0.60
V
G
C D H K J
STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE
CASE 318-07 ISSUE AD SOT-23 (TO-236AB)
A L
3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.035 0.049 0.012 0.016 0.047 0.055 0.000 0.004 0.004 0.010 0.017 REF 0.026 BSC 0.028 REF 0.031 0.039 0.079 0.087 0.012 0.016 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.90 1.25 0.30 0.40 1.20 1.40 0.00 0.10 0.10 0.25 0.425 REF 0.650 BSC 0.700 REF 0.80 1.00 2.00 2.20 0.30 0.40
S
1 2
B
V G
D
C 0.05 (0.002)
RN K
J
H
DIM A B C D G H J K L N R S V
STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE
CASE 419-02 ISSUE E SC-70/SOT-323
6
Motorola Small-Signal Transistors, FETs and Diodes Device Data
MMBD1005LT1 MMBD2005T1 MMBD3005T1
A L
3 2 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. DIM A B C D G H J K L S MILLIMETERS MIN MAX 2.70 3.10 1.30 1.70 1.00 1.30 0.35 0.50 1.70 2.10 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.65 2.50 3.00 INCHES MIN MAX 0.1063 0.1220 0.0512 0.0669 0.0394 0.0511 0.0138 0.0196 0.0670 0.0826 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0649 0.0985 0.1181
S
B
D G
C H K
J
STYLE 5: PIN 1. CATHODE 2. CATHODE 3. ANODE
CASE 318D-03 ISSUE E SC-59
Motorola Small-Signal Transistors, FETs and Diodes Device Data
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MMBD1005LT1 MMBD2005T1 MMBD3005T1
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. To order literature by mail: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. JAPAN: Nippon Motorola Ltd.; 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. To order literature electronically: MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com
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Motorola Small-Signal Transistors, FETs and Diodes Device Data MMBD1005LT1/D
*MMBD1005LT1/D*

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